IC substrate PCB technology can be divided by the connection method of IC and carrier board, and the connection method of carrier board and PCB. The connection method between IC and carrier can be divided into Flip Chip (FC) and Wire Bounded (WB). The connection between the carrier board and the PCB can be divided into BGA (Ball Grid Array) and CSP (Chip Scale Package, chip size package). Therefore, IC substrate PCB can be divided into four categories: PBGA, WBCSP, FCBGA and FC-CSP.
According to the base material,IC substrate PCB can also be divided into three types: rigid substrate, flexible substrate and ceramic substrate. The main factors considered for IC substrate PCB include dimensional stability, high-frequency characteristics, heat resistance and thermal conductivity. Currently, there are three main materials for rigid packaging substrates, namely BT material, ABF material and MIS material; The substrate materials of flexible packaging substrates mainly include PI (polyimide) and PE (polyester) resins; ceramic packaging substrate materials are mainly ceramic materials such as alumina, aluminum nitride, and silicon carbide.
IC substrate PCB are mainly used in lightweight high technology devices, such as smartphones, laptops, tablets, telecommunications, medical, industrial control, aerospace, and military fields.
