IC substrate is a type of base board used to package bare IC (integrate circuit) chip. There are circuits connecting between the chip and the printed circuit board. It protects, fixes and supports the IC chip and provides thermal dissipation tunnels. It is an intermediate product for linking up chips and PCB. IC Substrate requires finer, high density, high pin count, small volume, holes, pads and lines are finer and ultra-thin core. It has precise technology in inter-layer alignment, circuitry imaging, electrolytic plating, drilling and surface treatment.
